Featured Products

GSP 1353-4 is a rapid-cure, clear, two-component, general purpose adhesive. GSP 1353-4 can be used to encapsulate small electrical components. While curing, GSP 1353-4 will resist yellowing,...

GSP 1362 is a two-part epoxy potting compound designed for insulative encapsulation of electronic components in high-temperature applications. The cured system can withstand thermal cycling up to...

SM 2000-1 utilizes a novel hybrid chemistry producing a polymer with physical properties similar to both silicone and polyurethane. The system offers exceptional adhesion to metal and bonds to...

SM 2004 utilizes a novel hybrid chemistry producing a polymer with physical properties similar to both silicone and polyurethane. The system offers exceptional adhesion to metal and bonds to most...

GSP 1603-86 is a two-component polyurethane potting system developed for use as an
economical potting encapsulant.

Spanish SDS Available:

GSP 1552-2 is an optically-clear, two-part polyurethane system that cures at room temperature. With a convenient mix ratio (1 to 1 by both weight and volume), its low-viscosity A and B components...

GSP 1555 is an optically-clear, two-part polyurethane system that cures at room temperature. Its low-viscosity A and B components are easily mixed into a readily pourable material. Once cured, it...